Reflow Profile - Huawei MU609 Hardware Manual

HUAWEI MU609 HSPA LGA Module
Hardware Guide

6.8.3 Reflow Profile

For the soldering temperature of the LGA module, see the following figure.
Figure 6-5 Reflow profile
Table 6-2 Reflow parameters
Temperature Zone
Preheat zone
(40° C–150° C)
Soak zone
(150° C–200° C)
Reflow zone (> 217° C)
Cooling zone
Issue 04 (2016-12-12)
Time
60s–120s
(t1–t2): 60s–120s
(t3–t4): 30s–90s
Cooling rate: 1°C/s ≤ Slope ≤ 4°C/s
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Mechanical Specifications
Key Parameter
Heating rate: 0.5° C/s–2° C/s
Heating rate: < 1.0° C/s
Peak reflow temperature:
230° C–250° C
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