Introduction Of Packages - Hitachi AP1 Data Book

INTRODUCTION OF PACKAGES
Hitachi microcomputer devices are offered in a variety of
packages, to meet various user requirements.
1. Package Classification
When selecting suitable packaging, please refer to the
Package Classifications given in Fig. I for pin insertion, surface
mount, and multi-function types, in plastic and ceramic.
Package Classification
Pin Insertion Type
Surface Mounting Type
Multi·function Type
DIP; DUAL IN LINE PACKAGE
S·DIP; SHRINK DUAL IN LINE PACKAGE
PGA: PIN GRID ARRAY
FLAT·DIP; FLAT DUAL IN LINE PACKAGE
FLAT·QUIP; FLAT QUAD IN LINE PACKAGE
CC: CHIP CARRIER
SOP;SMALL OUTLINE PACKAGE
FPP; FLAT PLASTIC PACKA.GE
PLCC;PLASTIC LEADED CH1P CARRIER
LCC ; LEADLESS CHIP CARRI·ER
Plastic DIP
Ceramic DIP
Shrink Type Plastic DIP
Shrink Type Ceramic DIP
SOP (Plastic)
FPP (Plastic)
PLCC (Plastic)
LCC
(Glass Sealed Ceramic)
Fig. 1 Package Classification according to Material and Printed Circuit Board Mounting Type
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