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2-2. REMOVAL
Replacement procedure for Leadless (Chip) Components
The following procedures are recommended for the
replacement of the leadless components used in this unit .
1 . Preparation for replacement
a. Soldering Iron
Use a pencil-type soldering iron using less than 30
watts.
b. Solder
Eutectic Solder (Tin 63%, Lead 37%) is recommended.
c. Soldering time
Do not apply heat for more than 4 seconds.
d. Preheating
C
Leadless
capacitor
installation. (1 30
°
Note:
a. Leadless components must not be reused after
removal.
b. Excessive mechanical stress and rubbing of the
component electrode must be avoided.
2. Removing leadless components
Grasp the leadless component body with tweezers and
alternately apply heat to both electrodes. When the
solder on both elect rodes is melted, remove the leadless
component with a twisting motion.
a. Do not attempt to lift the component off the board
Note:
until the component is completely disconnected
from the board by a twisting action.
b.Take care not to break the copper foil on the
printed board.
Chip
Soldering Iron
C
must
be
preheated
,
- 1 50
for about two minutes.)
°
3. Installing leadless components
a. Presolder the contact points of the circuit board.
before
b. Press the part downward with tweezers and solder
both elecctrodes as shown below.
.
.
\"""' .. t
Note:
Do not glue the replacement leadless component to
the circuit board.
- 2 - 4 -
.
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\
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