Table 2-3 Thermally Significant Components - Motorola CPCI-6115 Installation And Use Manual

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Thermal Requirements

This section provides systems integrators with information that can be used to conduct thermal

evaluations of the board in their specific system configuration. It identifies thermally significant

components and lists the corresponding maximum allowable component operating

temperatures. It also provides sample procedures for component-level temperature

measurements.

Table 2-3 on page 33

are the components that should be monitored in order to assess thermal performance. The

table also supplies the component reference designator and the maximum allowable operating

temperature.

You can find components on the board by their reference designators as shown in

on page

34. Versions of the board that are not fully populated may not contain some of these

components.

The preferred measurement location for a component may be junction, case or air as specified

in the table. Junction temperature refers to the temperature measured by an on-chip thermal

device. Case temperature refers to the temperature at the top, center surface of the component.

Air temperature refers to the ambient temperature near the component.