Recommended Test Equipment; Service Tools And Aids; Parts Locations; Adjustment And Test Point Locations - HP 5334B Service Manual

d. When you think that you have found a bad signature, double check to make sure.
e. When checking a node, check that the unstable signature indicator is not blinking.
8-18. RECOMMENDED TEST EQUIPMENT
8-19. Table 1-5 lists the recommended equipment for the service procedures. If the specified equipment is not
available, other equipment may be used if its performance meets the critical specifications listed in Table 1-5.
Note that an H P 8565A Spectrum Analyzer (500 MHz-18 GHz) is needed to troubleshoot the 30 dB Amplifier
circuit in the Channel C Input Block.
8-20. SERVICE TOOLS AND AIDS
8-21. Parts Locations
8-22. The locations of individual components mounted on printed circuit boards or other assemblies are shown
adjacent to the appropriate schematic sheet. The part reference designation is the assembly designator plus the
part designator. For example, AIR9 is on the A1 assembly. For specific component descriptions and ordering in-
formation, refer to Section VI, Replaceable Parts. Chassis and frame parts, including mechanical parts, are also
identified in Section VI.
8-23. Adjustment and Test Point Locations
8-24. Adjustment locations are shown in the adjustment procedures of Section V. Adjustable components and
test points can be found on the component locator figure opposite the particular assembly's schematic sheet.
8-25. Service Aids on Printed Circuit Boards
a
8-26. The service aids on printed circuit boards include test points and integrated circuit designations. Thesc
component reference designators are printed onto the A1 Main Board and are reference on the schematic
diagram as well. Test points are provided for measuring signals at several points in a circuit.
8-27. Pozidriv Screwdrivers
8-28. Many screws in the H P 5334B appear to be Phillips screws, but are not. To avoid damage to the screw
slots, Pozidriv screwdrivers should be used.
8-29. REPAIRS
8-30. Cleaning Printed-Circuit Boards
8-31. After soldering a component to a printed-circuit (PC) board, H P recommends that you DO NOT remove
the flux from the soldered area. It has been found that after a hand soldering operation, the solder flux from
RMA-P2 (Rosin, Mildly Active) solder does no harm if left in place on a PC board; the flux residue is inert and
nonconductive. However, when the flux is dissolved with a chemical, in an attempt to remove it from the board,
it spreads over the board, releasing several activators (chlorides, bromides, etc.). Now, instead of having a harm-
less flux residue with the water soluble activators trapped inside, you have a potential corrosion problem. IC the
instrument is stored in a humid environment, over time moisture will be absorbed which can start the corrosion
process.
H P 5334B
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Service Manual
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