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BThermal Analysis
B
Ambient temperature, air flow, board electrical operation, and software
operation affect board component temperatures. To evaluate the thermal
performance of a circuit board assembly, you should test the board under
actual operating conditions. These operating conditions vary depending on
system design.
Motorola Computer Group performs thermal analysis in a representative
system to verify operation within specified ranges. Refer to Specifications,
Table
A-2. You should evaluate the thermal performance of the board in
your application.
This appendix gives systems integrators the information necessary to
conduct thermal evaluations of the board in their specific system
configuration. It identifies thermally significant components and lists the
corresponding maximum allowable component operating temperatures. It
also provides example procedures for component-level temperature
measurements.
Thermally Significant Components
Table B-1
summarizes components that show significant temperature
rises. You should monitor these components to assess thermal
performance.
Table B-1
also supplies the component reference designator
and the maximum allowable operating temperature.
You can find components on the board by their reference designators.
Refer to
Figure B-1
and
Figure
B-2.
B-1
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