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Use Caution When Installing or Removing Boards
When first installing boards in an empty chassis, we recommend that you
start at the left of the card cage and work to the right when cards are
vertically aligned; in horizontally aligned cages, work from bottom to top.
When inserting or removing a board in a slot adjacent to other boards, use
extra caution to avoid damage to the pins and components located on the
primary or secondary sides of the boards.
Preserve EMI Compliance
To preserve compliance with applicable standards and regulations for
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electromagnetic interference (EMI), during operation all front and rear
openings on the chassis or board faceplates must be filled with an
Caution
appropriate card or covered with a filler panel. If the EMI barrier is open,
devices may cause or be susceptible to excessive interference.
Understand Hot Swap
Inserting or removing non-hot swap cards or transition modules with
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power applied may result in damage to module components. Make sure
that your board manufacturer identifies your module as hot swap ready.
Caution
The PICMG 2.1 Hot Swap specification defines varying levels of hot
swap. A board that is compliant with the specification can be inserted and
removed safely with system power on without damage to on-board
circuitry. If a module is not hot swap compliant, you should remove power
to the slot or system before inserting or removing the module.
To facilitate hot swap, PICMG 2.1 specifies a blue LED on the faceplate.
This LED is under software control.
If your system is using software that provides full hot swap capabilities,
the software will illuminate the blue hot swap LED on the faceplate when
software has stopped and it is safe to remove the board.
http://www.motorola.com/computer/literature
Before You Install or Remove a Board
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