Huawei SmartAX MA5600T Hardware Description page 15

SmartAX MA5600T/MA5603T/MA5608T Multi-service
Access Module
Hardware Description Contents
2.5.8 Grounding................................................................................................................................................................ 130
2.5.9 Power Distribution Principle................................................................................................................................... 130
2.5.10 Heat Dissipation.................................................................................................................................................... 131
2.6 MA5608T Chassis Description.................................................................................................................................. 131
2.6.1 Appearance.............................................................................................................................................................. 131
2.6.2 Physical Specifications............................................................................................................................................ 132
2.6.3 Configuration...........................................................................................................................................................134
2.6.4 Fan Tray...................................................................................................................................................................136
2.6.5 ESD Jack..................................................................................................................................................................138
2.6.6 Grounding................................................................................................................................................................ 138
2.6.7 Power Distribution Principle................................................................................................................................... 139
2.6.8 Heat Dissipation...................................................................................................................................................... 140
3 Board............................................................................................................................................ 141
3.1 Board Overview..........................................................................................................................................................143
3.1.1 Board Structure........................................................................................................................................................143
3.1.2 Board Dimensions................................................................................................................................................... 145
3.1.3 Board Name and Version......................................................................................................................................... 147
3.1.4 Board Label............................................................................................................................................................. 148
3.2 Mapping Between Boards and Software Versions..................................................................................................... 149
3.3 Power Consumption and Maximum Frame Size of Boards....................................................................................... 169
3.4 Board Configuration(MA5600T/MA5603T)............................................................................................................. 183
3.5 Board Configuration(MA5608T)............................................................................................................................... 193
3.6 Control Board (SCU)..................................................................................................................................................196
3.6.1 SCU Boards Comparison.........................................................................................................................................196
3.6.2 H801SCUB Board Description............................................................................................................................... 202
3.6.3 H802SCUB Board Description............................................................................................................................... 206
3.6.4 H801SCUF Board Description................................................................................................................................ 210
3.6.5 H801SCUH Board Description............................................................................................................................... 215
3.6.6 H801SCUK Board Description............................................................................................................................... 218
3.6.7 H801SCUL Board Description................................................................................................................................222
3.6.8 H801SCUN Board Description............................................................................................................................... 226
3.6.9 H802SCUN Board Description............................................................................................................................... 230
3.6.10 H801SCUV Board Description............................................................................................................................. 234
3.6.11 Daughter Board......................................................................................................................................................238
3.7 Control Board (MCU)................................................................................................................................................ 239
3.7.1 MCU Boards Comparison....................................................................................................................................... 239
3.7.2 H801MCUD Board Description.............................................................................................................................. 240
3.7.3 H801MCUD1 Board Description............................................................................................................................ 244
3.7.4 H801MCUE Board Description.............................................................................................................................. 249
3.8 Upstream Interface Board (GIU)................................................................................................................................ 253
3.8.1 Upstream Interface Boards Comparison..................................................................................................................253
3.8.2 H801GICD Board Description................................................................................................................................ 259
Issue 24 (2018-07-30) Huawei Proprietary and Confidential xiv
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