Package Dimensions; Fe Suffix - Motorola MC68340 User Manual

12.3 PACKAGE DIMENSIONS

12.3.1 FE Suffix

FE SUFFIX PACKAG
CERAMIC QFP
CASE 863A-01
Z
0.50
M
C
J
W
H
MILLIMETE
DIM MIN MAX
A 25.84 27.70
B 25.84 27.70
C 3.55 4.31
D 0.22 0.41
G 0.65 BS
H 0.25 0.88
J 0.13 0.25
K 0.65 0.95
M 0 8
Q 0.325 BS
12-6
Freescale Semiconductor, Inc.
Q
T X Y Z
S S
D
144X
Z
0.20 T X-Y
M
0.20 T Z X-Y
M S
S/V
SIDE VIEW
GULL WING LEAD CONFIGURA
NOTES:
INCHE
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M
MIN MAX
2. CONTROLLING DIMENSION: MILLIMETERS
1.017 1.09
3. DIM A AND B DEFINE MAXIMUM CERAMIC BODY DIMEN
1.017 1.09
INCLUDING GLASS PROTRUSION AND MISMATCH OF CE
0.140 0.170
BODY TOP AND BOTTOM.
0.009 0.016
4. DATUM PLANE -W- IS LOCATED AT THE UNDERSIDE O
0.0256 BS
WHERE LEADS EXIT PACKAGE BODY.
0.010 0.035
5. DATUMS X-Y AND Z TO BE DETERMINED WHERE CENT
0.005 0.010
EXIT PACKAGE BODY AT DATUM -W-.
0.026 0.037
6. DIM S AND V TO BE DETERMINED AT SEATING PLANE
0 8
7. DIM A AND B TO BE DETERMINED AT DATUM PLANE -
0.0128 BS
MC68340 USER'S MANUAL
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Go to: www.freescale.com
X
Y
G
S
S
PIN ONE INDEN
TOP VIEW
TRIMMED, FORMED DISCRET
SHOWING DATUM FEATUR
R
K
M
M
0.10 144X
T SEATING PLANE
0.20 T X-Y Z S
0.20 T Z X-Y
S S S
MOTOROLA