Pad - Huawei FusionModule2000 Product Description

FusionModule2000 Smart Modular Data Center
Product Description (380 V)
Indicator

3.4.17 Pad

The pad allows the wireless access from the data center management system. You can monitor
the equipment in the data center and environmental parameters in real time over the APP
Figure 3-88 shows a pad.
Figure 3-88 Pad
The pad used in the micro-module is a capacitive touchscreen that supports multi-touch
technology. Table 3-91 lists the pad structural specifications.
Table 3-91 Pad structural specifications
Item
Dimensions (L x W x
H)
Weight
Table 3-92 lists pad technical specifications.
Table 3-92 Pad technical specifications
Item
Touchscreen
Chip processor
WLAN
Issue 04 (2017-06-30)
Color Name
Specifications
248.5 mm x 150 mm x 8.3 mm
About 433 g
Specifications
9.6-inch, 1280x800 IPS full view, IPS screen, and capacitive
five-point touch
MSM8916, quad-core A53, 1.2 GHz integrated chip
802.11a/b/g/n@2.4GHz&5GHz
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
Status Description
Off No system alarm is
generated.
3 System Architecture
124