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Chapter 4
Design
Considerations
4.1 Thermal Design Considerations
The average chip-junction temperature
Equation 1: T
where
The user should set T
T
J
= T
+ (P
J
A
D
= ambient temperature °C
T
A
θ
= package thermal resistance
JA
P
= P
D
P
INT
P
= power dissipation on output pins in W—user determined
I/O
and P
such that T
A
D
is too high, the user should either lower the ambient temperature or the power dissipation of the chip.
in °C can be obtained from the following:
T
,
,
J
• θ
)
JA
,
+ P
in W
INT
I/O
× V
= I
in W—chip internal power
DD
DD
does not exceed the maximum operating conditions. In case
J
°C/W
junction to ambient
,
4-1
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