Lenovo ThinkSystem SR630 Maintenance Manual page 13

Table 1. Server specifications
Specification
Dimension
Package weight
Processor
Heat sink
Description
• 1U
• Height: 43.0 mm (1.69 inches)
• Width: 439.2 mm (17.29 inches)
• Depth: 772.6 mm (30.42 inches)
Note: The depth is measured without PSU handles or security bezel installed.
Up to 26.3 kg (57.98 lb)
Supports multi-core Intel Xeon processors, with integrated memory controller and
Intel Mesh Ultra Path Interconnect (UPI) topology.
• Up to two Intel ® Xeon ® processors
• Designed for Land Grid Array (LGA) 4189 socket
• Scalable up to 40 cores per socket, 80 cores in total
• Thermal Design Power (TDP): up to 270 watts
• Supports 3 UPI links up to 11.2 GT/s
For a list of supported processors, see
.
index.shtml
Only one processor is supported if you use the 8351N processor or processor with
the suffix of "U".
For technical rules for processors and heat sinks, see "Technical rules for processors
and heat sinks" on page 86.
• Standard heat sink
• High-performance heat sink (T-shape)
For technical rules for processors and heat sinks, see "Technical rules for processors
and heat sinks" on page 86.
https://static.lenovo.com/us/en/serverproven/
Chapter 1
.
Introduction
3