Lenovo ThinkSystem SR665 V3 User Manual page 70

Storage configurations
This section provides thermal information for storage configurations.
Front Support
bays middle bays
N
N
N
N
N
24 x 2.5"
N
16 x 2.5" +
FIO
Y*
Y*
N
Y
Y
N
N
N
Y*
12 x 3.5"
Y*
N
Y
Y
Notes:
• Group E processors in the table above include 9654(P), 9554(P), 9174F, 9754, and 9734.
• A part with AOC and at a rate greater than 25 GB is supported under the following conditions:
– Performance fans are used.
– The part is not installed on slot 3.
• The following parts are not supported in storage configurations:
– Broadcom 57416 10GBASE-T 2-port OCP
– Broadcom 57454 10GBASE-T 4-port OCP
GPU configurations
This section provides thermal information for the GPU configuration.
• Half-height half-length (HHHL) single-wide (SW) GPU: A2
• HHHL double-wide (DW) GPU: A2000
• Full-height full-length (FHFL) DW GPU: A30, A4500, A16, A40, A100, A6000, H100, AMD MI210
ThinkSystem SR665 V3 User Guide
60
Support Max.
rear bays Temp.
N 30°C
30°C
N
N 30°C
N 25°C
N 25°C
Y* 30°C
N 30°C
Y* 30°C
Y 25°C
N 25°C
Y 25°C
N 30°C
N 30°C
Y* 30°C
N 30°C
Y* 30°C
Y 25°C
N 25°C
Y 25°C
Heat
Processor
sink
Group B
2U S
Group B
2U S
Group A
2U P
Group B
2U S
Group A, E
2U P
Group B
2U P
Group B
2U P
Group B
2U P
Group B, A
2U P
Group B, A
2U P
Group B, A
2U P
Group B
2U S
Group A
2U P
Group B
2U P
Group B
2U P
Group B
2U P
Group B, A
2U P
Group B, A
2U P
Group B, A
2U P
Support
Air DIMMs
Fan type
baffle
S S N
S P Y
S P Y*
S P Y
S P Y*
S P Y*
NA P Y*
NA P Y*
S P Y
NA P Y
NA P Y
S P Y
S P Y*
S P Y*
NA P Y*
NA P Y*
S P Y
NA P Y
NA P Y
>= 96
GB