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Signal processing and communication module (CPU and COM)
Signal-processing and communication module (CPU) is made with a main circuit board (CP1M)
and communication 'piggyback' circuit boards (COM#1 to COM#3). COM#1 and COM#2 are
provided for LAN communication (Ethernet). On the other hand, optional COM#3 can be
chosen for the expansion, such as time synchronization, optical links etc. Figure 5.5-1
illustrates a module layout.
Figure 5.5-1 CPU and communication modules (COM#1, #2, #3)
Signal processing
5.5.1
Application calculations are carried out on CPU module; the CPU has SDRAM, MRAM, and
NOR-Flash memories.
NOR-Flash is used to store setting data and recording data. MRAM is used to store several
counter values, etc. They are non-volatile memory so that the stored data will not be cleared
during the IED is powered off.
IED
VCT
CPU
CP1M
CPU
CPU
CP1M
BIO#1
BIO#2
BIO#3
Figure 5.5-2 Processing diagram
- 645 -
COM#1
COM#2
COM#3
COM#1
LAN network
COM#2
COM#3
IRIG-B
6F2T0207 (0.01)
GRE200 (5,6)
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