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1 OVeRVieW
Chip (S1C17604)
SCLK1/AIN4/P16
AIN3/P17
AIN2/P20
AIN1/P21
AIN0/P22
V
DD
SENB0/P23
SENA0/P24
REF0/P25
RFIN0/P26
V
SS
SOUT1/RFIN1/P27
SIN1/REF1/P30
SCL0/SENA1/TOUTA5/CAPA5/P31
SDA0/SENB1/TOUTB5/CAPB5/P32
N.C.
N.C.
N.C.
N.C.
SCL1/SCL0/TOUTA6/CAPA6/P33
SDA1/SDA0/TOUTB6/CAPB6/P34
FOUT1/#BFR/P35
TOUT3/RFCLKO/(eXCl5)P36
TOUTN3/LFRO/TOUT4/(eXCl6)P37
FOUTH/P40
P41/DSiO
P42/DST2
P43/DClK
N.C.
N.C.
N.C.
N.C.
SeG0
Chip size
X = 4.200 mm, Y = 4.256 mm
Pad opening
No. 1 to 32, 66 to 97:
No. 33 to 65, 98 to 130: X = 85 µm, Y = 87 µm
Chip thickness 400 µm
* The S1C17604 chip has the same pad configuration and coordinates as those of the S1C17624.
However, the P44–P47, P50–P56, and SEG40–SEG55 pads do not exist in the S1C17604 chip.
1-8
98
99
100
101
102
103
104
105
106
107
108
109
110
111
112
113
114
115
116
117
118
119
120
121
122
123
124
125
126
127
128
129
130
Figure 1.
3.2.2 S1C17604 Pad Configuration Diagram
X = 87 µm, Y = 85 µm
Seiko epson Corporation
Y
X
(0, 0)
Die No.
CJ624D***
4.200 mm
S1C17624/604/622/602/621 TeChniCal Manual
V
65
SS
V
64
C1
63
V
C2
V
62
C3
Ca
61
CB
60
N.C.
59
58
N.C.
N.C.
57
COM0
56
COM1
55
COM2
54
COM3
53
SeG39/COM4
52
SeG38/COM5
51
50
SeG37/COM6
SeG36/COM7
49
N.C.
48
47
N.C.
N.C.
46
45
N.C.
N.C.
44
43
N.C.
SeG35
42
SeG34
41
SeG33
40
SeG32
39
SeG31
38
SeG30
37
SeG29
36
SeG28
35
SeG27
34
SeG26
33
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