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Chip (S1C17602/621)
SCLK1/AIN4/P16
AIN3/P17
AIN2/P20
AIN1/P21
AIN0/P22
V
DD
SENB0/P23
SENA0/P24
REF0/P25
RFIN0/P26
V
SS
N.C.
SOUT1/RFIN1/P27
SIN1/REF1/P30
SCL0/SENA1/P31
SDA0/SENB1/P32
SCL1/SCL0/P33
SDA1/SDA0/P34
FOUT1/#BFR/P35
TOUT3/RFCLKO/P36
TOUTN3/LFRO/TOUT4/P37
N.C.
FOUTH/P40
P41/DSiO
P42/DST2
N.C.
P43/DClK
N.C.
SeG0
N.C.
Chip size
X = 3.900 mm, Y = 3.856 mm
Pad opening
No. 1 to 29, 60 to 88:
No. 30 to 59, 89 to 118: X = 85 µm, Y = 87 µm
Chip thickness 400 µm
S1C17624/604/622/602/621 TeChniCal Manual
89
90
91
92
93
94
95
96
97
98
99
100
101
102
103
104
105
106
107
108
109
110
111
112
113
114
115
116
117
118
Figure 1.
3.4.3 S1C17602/621 Pad Configuration Diagram
X = 87 µm, Y = 85 µm
Seiko epson Corporation
Y
X
(0, 0)
Die No.
CJ602D***
3.900 mm
1 OVeRVieW
V
59
SS
V
58
C1
V
57
C2
V
56
C3
Ca
55
CB
54
N.C.
53
N.C.
52
N.C.
51
COM0
50
COM1
49
COM2
48
COM3
47
SeG39/COM4
46
SeG38/COM5
45
SeG37/COM6
44
SeG36/COM7
43
SeG35
42
SeG34
41
SeG33
40
SeG32
39
SeG31
38
SeG30
37
SeG29
36
SeG28
35
34
N.C.
SeG27
33
32
N.C.
SeG26
31
N.C.
30
1-15
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